Apparatus for manufacturing display apparatus and method of manufacturing display apparatus

ABSTRACT

An apparatus and method for manufacturing a display apparatus includes: a chamber; a first nozzle unit at the chamber, the first nozzle unit configured to deposit an organic layer or an inorganic layer on a substrate; a second nozzle unit at the chamber, the second nozzle unit configured to deposit the organic layer or the inorganic layer on a substrate and the second nozzle unit being linearly aligned with the first nozzle unit in a first direction; and an injection nozzle unit between the first nozzle unit and the second nozzle unit, the injection nozzle unit configured to inject a first gas in the chamber toward the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2015-0014589, filed on Jan. 29, 2015 in the KoreanIntellectual Property Office, the entire contents of which areincorporated herein by reference.

BACKGROUND

1. Field

One or more exemplary embodiments of the present invention relate to amethod and apparatus for manufacturing a display apparatus.

2. Description of the Related Art

Mobile electronic devices have become widely used. Mobile electronicdevices, such as tablet personal computers (PCs), as well as smallelectronic devices, such as mobile phones, have come into widespread usein recent times.

The mobile electronic devices often include a display apparatus forproviding visual information such as an image or a video. Recently, ascomponents for driving the display apparatus have become miniaturized,the display apparatus has gained an increased significance in the mobileelectronic devices. Also, a structure in which the display apparatus isbent or bendable according to a pre-determined angle has been developed.

In particular, when the display apparatus is formed to be bendable orflexible as described above, a display unit of the display apparatus maybe encapsulated by using multiple thin films, in consideration of thelife span of the display apparatus. As such, one or more encapsulationthin films may be formed, and the encapsulation thin films may be formedby alternately stacking an organic layer and an inorganic layer. Theorganic layer and the inorganic layer forming the encapsulation thinfilm may be separately formed by using various methods.

Information disclosed in this Background section is only for enhancementof understanding of the invention and may include technical informationacquired in the process of achieving the inventive concept. Therefore,it may contain information that does not form prior art.

SUMMARY

One or more exemplary embodiments include a method and apparatus formanufacturing a display apparatus.

Additional aspects are set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented example embodiments.

According to one or more exemplary embodiments, an apparatus formanufacturing a display apparatus includes: a chamber; a first nozzleunit at the chamber, the first nozzle unit configured to deposit anorganic layer or an inorganic layer on a substrate; a second nozzle unitat the chamber, the second nozzle unit configured to deposit the organiclayer or the inorganic layer on a substrate and the second nozzle unitbeing linearly aligned with the first nozzle unit in a first direction;and an injection nozzle unit between the first nozzle unit and thesecond nozzle unit, the injection nozzle unit configured to inject afirst gas in the chamber toward the substrate.

The first gas may be injected by the injection nozzle unit and may bedischarged by the first nozzle unit or the second nozzle unit.

The first nozzle unit may include a first supply nozzle unit thatinjects a first source gas, and a first discharge nozzle unit betweenthe injection nozzle unit and the first supply nozzle unit, the firstdischarge nozzle unit discharging at least one selected from the firstgas and the first source gas.

The first discharge nozzle unit may discharge a mixture of the first gasand the first source gas.

The first source gas and the first gas may be injected in a seconddirection toward the substrate and may be discharged in a thirddirection opposite to the second direction.

The second nozzle unit may include a second supply nozzle unit thatinjects a second source gas, a second discharge nozzle unit outside thesecond supply nozzle unit, the second discharge unit discharging thesecond source gas, and a third discharge nozzle unit between theinjection nozzle unit and the second discharge nozzle unit, the thirddischarge nozzle unit discharging the first gas.

The second nozzle unit may further include a separation nozzle unitbetween the second discharge nozzle unit and the third discharge nozzleunit, the separation nozzle unit injecting a purge gas.

The second nozzle unit may discharge the first gas and the second sourcegas separately.

The second source gas and the first gas may be injected in the seconddirection toward the substrate and may be discharged in the thirddirection opposite to the second direction.

The injection nozzle unit may inject the first gas stored in the chamberin the second direction toward the substrate to concurrently clean thefirst nozzle unit and the second nozzle unit.

The first nozzle unit and the second nozzle unit may have the same size.

The apparatus may further include a substrate mounting unit under thefirst nozzle unit and the second nozzle unit the substrate mounting unitmoving in a linear reciprocating motion in the first direction andholding the substrate. The substrate may have a display unit thereon.

The apparatus may further include a loading unit connected to an end ofthe chamber and that inserts the substrate into the chamber, thesubstrate having a display unit thereon, and an unloading unit connectedto an opposite end of the chamber, the unloading unit removing thesubstrate from the chamber after at least one selected from the organiclayer and the inorganic layer is formed on the substrate.

The apparatus may further include a protection layer-forming deviceconnected to the unloading unit, the protection-layer forming deviceforming a protection layer on the display unit.

According to one or more exemplary embodiments, an apparatus formanufacturing a display apparatus includes: a chamber configured to befilled with a first gas; an encapsulation layer-forming nozzle unit atthe chamber and including a first nozzle unit that deposits an organiclayer or an inorganic layer and a second nozzle unit that deposits theorganic layer or the inorganic layer, the second nozzle unit beingspaced apart from the first nozzle unit; and a substrate mounting unitunder the encapsulation layer-forming nozzle unit, that moves in alinear reciprocating motion in a first direction and is holds asubstrate having a display unit formed thereon.

The first gas may pass through a gap between the first nozzle unit andthe second nozzle unit to flow into the first nozzle unit and the secondnozzle unit.

The first nozzle unit may inject a first source gas toward the substrateand may discharge a mixture of the first source gas and the first gas.The second nozzle unit may inject a second source gas toward thesubstrate and may discharge the second source gas and the first gasseparately.

According to one or more exemplary embodiments, a method ofmanufacturing a display apparatus includes: inserting a substrate into achamber filled with a reactive gas, the substrate having a display unitformed on a surface thereof; forming an encapsulation layer bydepositing an organic layer or an inorganic layer on the display unitvia a first nozzle unit inside the chamber and depositing the organiclayer or the inorganic layer on the display unit via a second nozzleunit linearly aligned with the first nozzle unit; and forming aprotection layer on the encapsulation layer via a protectionlayer-forming device connected to the chamber.

The forming of the encapsulation layer may include forming the organiclayer by mixing a first source gas and the reactive gas in the firstnozzle unit and forming the inorganic layer by separating a secondsource gas and the reactive gas in the second nozzle unit.

The method may further include cleaning the first nozzle unit and thesecond nozzle unit by injecting a cleaning gas into the chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of exemplary embodiments,taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic view of an apparatus for manufacturing a displayapparatus, according to one or more exemplary embodiments;

FIG. 2 is a cross-sectional view of a thin film encapsulationmanufacturing device of FIG. 1;

FIG. 3 is a cross-sectional view of a first nozzle unit of FIG. 2;

FIG. 4 is a cross-sectional view of a second nozzle unit of FIG. 2;

FIG. 5 is a cross-sectional view that illustrates a method of cleaningof a thin film encapsulation manufacturing device according to one ormore exemplary embodiments; and

FIG. 6 is a cross-sectional view of a substrate that is manufactured bythe apparatus for manufacturing a display apparatus of FIG. 1.

DETAILED DESCRIPTION

Reference is made herein to exemplary embodiments of the presentinvention, examples of which are illustrated in the accompanyingdrawings, wherein like reference numerals refer to like elementsthroughout. In this regard, the present exemplary embodiments may havedifferent forms and should not be construed as being limited to thedescriptions set forth herein. Accordingly, the exemplary embodimentsare merely described below, by referring to the figures, to explainaspects of the present invention. It will be understood that althoughthe terms “first,” “second,” etc. may be used herein to describe variouscomponents, these components should not be limited by these terms. Thesecomponents are only used to distinguish one component from another. Asused herein, the singular forms “a,” and “an” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including” used herein specify thepresence of stated features or components, but do not preclude thepresence or addition of one or more other features or components. Theuse of “may” when describing embodiments of the present invention refersto “one or more embodiments of the present invention.” Also, the term“exemplary” is intended to refer to an example or illustration.

Sizes of elements in the drawings may be exaggerated for convenience ofexplanation. In other words, because sizes and thicknesses of componentsin the drawings are arbitrarily illustrated for convenience ofexplanation, the following embodiments are not limited thereto. When acertain embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

It will be understood that when an element or layer is referred to asbeing “on” another element or layer, it can be directly on the otherelement or layer, or one or more intervening elements or layers may bepresent. In addition, it will also be understood that when an element orlayer is referred to as being “between” two elements or layers, it canbe the only element or layer between the two elements or layers, or oneor more intervening elements or layers may also be present.

As used herein, the term “and/or” includes any and all combinations ofone or more of the associated listed items. Expressions such as “atleast one of,” when preceding a list of elements, modify the entire listof elements and do not modify the individual elements of the list.

FIG. 1 is a schematic view of an apparatus for manufacturing a displayapparatus 1, according to one or more embodiments of the presentinvention.

Referring to FIG. 1, the apparatus for manufacturing a display apparatus1 may include a loading unit 10, a thin film encapsulation manufacturingdevice 20, an unloading unit 30, and a protection layer forming device40.

The loading unit 10 may load a substrate 210 that is supplied fromoutside the apparatus for manufacturing a display apparatus 1 and maytransport the substrate 210 to the thin film encapsulation manufacturingdevice 20. The loading unit 10 may be the same as or similar to aloading chamber that is generally used for manufacturing a displayapparatus, and thus, the loading unit 10 is not described in detail.

The loading unit 10 may be connected to a display device depositionapparatus and may be inserted into the thin film encapsulationmanufacturing device 20 after a display unit D is deposited on thesubstrate 210. The display device deposition apparatus is a device thatdeposits layers that are formed by being patterned, from among layersinterposed between a pixel electrode and an opposite electrode of anorganic light-emitting display apparatus instead of being integrallyformed throughout the pixels. For example, the display device depositionapparatus may be a device that deposits a red emission layer, a greenemission layer, and a blue emission layer.

The thin film encapsulation manufacturing device 20 integrally forms anencapsulation unit E on the entire surface of an organic light-emittingdevice (OLED) that is patterned.

The unloading unit 30 may transport the substrate 210 that is suppliedfrom the thin film encapsulation manufacturing device 20 to theprotection layer forming device 40. The unloading unit 30 may include arobot arm to transport the substrate 210.

The protection layer forming device 40 may form a protection layer P.The protection layer P may be formed according to various methods. Forexample, the protection layer P may be formed by using a sputteringmethod, an ion beam deposition method, an evaporation method, or achemical vapor deposition method.

FIG. 2 is a cross-sectional view of the thin film encapsulationmanufacturing device 20 of FIG. 1. FIG. 3 is a cross-sectional view of afirst nozzle unit 110 of FIG. 2. FIG. 4 is a cross-sectional view of asecond nozzle unit 120 of FIG. 2.

Referring to FIGS. 2 and 3, the thin film encapsulation manufacturingdevice 20 may include a chamber 101, the first nozzle unit 110, thesecond nozzle unit 120, an injection nozzle unit 140, and a substratemounting unit 170.

The chamber 101 may be connected to the loading unit 10 and to theunloading unit 30. A gate valve 2 may be provided between the chamber101 and the loading unit 10 and between the chamber 101 and theunloading unit 30.

The first nozzle unit 110, the second nozzle unit 120, and the substratemounting unit 170 may be formed in the chamber 101. The first nozzleunit 110 and the second nozzle unit 120 may be arranged in a linearalignment in a first direction (e.g., may be arranged in parallel or inan in-line shape).

The arrangement of the first nozzle unit 110 and the second nozzle unit120 may have any suitable arrangement according to an order of anorganic layer and an inorganic layer (e.g., according to a desiredstacking order of an organic layer and an inorganic layer). For example,according to one or more embodiments, the first nozzle unit 110 and thesecond nozzle unit 120 may be alternately stacked and the injectionnozzle unit 140 may be formed between the first nozzle unit 110 and thesecond nozzle unit 120. That is, the first nozzle unit 110, theinjection nozzle unit 140, and the second nozzle unit 120 may form onegroup and a plurality of groups may be linearly aligned, or formed in anin-line alignment.

According to one or more embodiments, a plurality of first nozzle units110 may be sequentially arranged, and the second nozzle unit 120 may beformed adjacent to any one of the plurality of first nozzle units 110.According to another embodiment, a plurality of second nozzle units 120may be sequentially arranged, and the first nozzle unit 110 may beformed adjacent to any one of the plurality of second nozzle units 120.That is, the number of the first nozzle units 110 may be greater thanthe number of the second nozzle units 120, or the number of the secondnozzle units 120 may be greater than the number of the first nozzleunits 110.

The arrangement of the first nozzle unit 110 and the second nozzle unit120 is not limited to the embodiments described above, and may includeany suitable arrangement such that the deposited organic layer andinorganic layer are stacked, regardless of the order of the first nozzleunit 110 and the second nozzle unit 120.

However, for convenience of explanation, the description below is madewith reference to one or more embodiments wherein the first nozzle units110 and the second nozzle units 120 are alternately arranged, and theinjection nozzle unit 140 is formed between the first nozzle unit 110and the second nozzle unit 120.

A gas may be filled in the chamber 101 through an upper portion thereof.An inflow pipe 102 may be connected to the chamber 101 and a chargespace S1 of the chamber 101 may be charged with a first gas.

The first gas with which the chamber 101 is charged may vary accordingto an intended use of the thin film encapsulation manufacturing device20. If the first gas is a reactive gas, the encapsulation unit E may beformed on the substrate 210 in the thin film encapsulation manufacturingdevice 20. The reactive gas may pass through the injection nozzle unit140 and may form an organic layer or an inorganic layer by reacting witha first source gas of the first nozzle unit 110. In addition, thereactive gas may pass through the injection nozzle unit 140 and may formthe organic layer or the inorganic layer by reacting with a secondsource gas of the second nozzle unit 120. Also, the first nozzle unit110 and the second nozzle unit 120 may form different layers havingdifferent characteristic.

For the reactive gas, a reactive gas that reacts with the first sourcegas and with the second source gas may be used. Also, if a gas injectedinto the chamber 101 reacts with either one of the first source gas andthe second source gas, or if the gas injected into the chamber 101 doesnot react with the first source gas and the second source gas, the gasinjected into the chamber 101 may be converted into a reactive gas of aradical state by using a plasma. A plasma generating device may beformed in the chamber 101 to convert the first gas into the radicalstate, and the converted first gas may react with the first source gasand the second source gas.

During cleaning of the thin film encapsulation manufacturing device 20,the first gas may be used as a cleaning gas. The cleaning gas is notlimited to a particular gas, and may include any suitable gas that canclean the inside portion of the first nozzle unit 110 and the secondnozzle unit 120. For example, the cleaning gas may include chlorine(Cl₂), nitrogen trifluoride (NF₃), boron trichloride (BCl₃), or carbontetrachloride (CCl₄).

An encapsulation layer forming nozzle unit 130 may include the firstnozzle unit 110 and the second nozzle unit 120. The first nozzle unit110 and the second nozzle unit 120 may be the same or substantially thesame size. The encapsulation layer forming nozzle unit 130 may exchangethe first nozzle unit 110 and the second nozzle unit 120 according to adesired shape or order of a stack of the encapsulation unit E on thesubstrate 210. That is, the order of the first nozzle unit 110 and thesecond nozzle unit 120 may be changed or the number of either of thefirst nozzle units 110 and the second nozzle units 120 may be greaterthan the number of the other, according to an order of the organic layerand the inorganic layer or the number of the organic layers and theinorganic layers, which are deposited on the substrate 210.

The first nozzle unit 110 may be formed in a lower portion of the chargespace S1. The first nozzle unit 110 may deposit the organic layer or theinorganic layer by using chemical vapor deposition. The first nozzleunit 110 may include a first supply nozzle unit 111 and a firstdischarge nozzle unit 112.

The first supply nozzle unit 111 may be formed in the center of thefirst nozzle unit 110 and may inject the first source gas. The firstsource gas may be supplied to the first supply nozzle unit 111separately and may move (or flow) in a second direction (e.g., in adownward direction) along the first supply nozzle unit 111. That is, thefirst supply nozzle unit 111 may inject the first source gas toward thesubstrate 210.

The first discharge nozzle unit 112 is formed around an outer portion ofthe first supply nozzle unit 111. The first discharge nozzle unit 112may be arranged to surround a portion of the first supply nozzle unit111. That is, the first discharge nozzle unit 112 may be formed betweenthe injection nozzle unit 140 and the first supply nozzle unit 111. Thefirst discharge nozzle unit 112 may surround the first supply nozzleunit 111 and may converge above an upper portion of the first supplynozzle unit 111.

The first discharge nozzle unit 112 forms a channel through which thereactive gas or the first source gas is discharged. That is, the firstdischarge nozzle unit 112 may form the channel through which thereactive gas and the first source gas are discharged after being reactedwith each other.

The first discharge nozzle unit 112 is connected to a first dischargepipe 151 that may discharge the first source gas or the reactive gas tothe outside. A supporter 160 is formed outside the first dischargenozzle unit 112 to fix the first nozzle unit 110 to the chamber 101.

The second nozzle unit 120 may be formed at the lower portion of thecharge space S1 and may be disposed in line with the first nozzle unit110 (e.g., may be linearly aligned or in parallel with the first nozzleunit 110). The first nozzle unit 110 and the second nozzle unit 120 maybe aligned with each other in a first direction (e.g., a lengthwisedirection of the chamber 101). The second nozzle unit 120 may depositthe inorganic layer by an atom layer deposition method. The secondnozzle unit 120 may include a second supply nozzle unit 121, a seconddischarge nozzle unit 122, a third discharge nozzle unit 123, and aseparation nozzle unit 124.

The second supply nozzle unit 121 may be formed at the center of thesecond nozzle unit 120 and may inject the second source gas. The secondsource gas may be supplied to the second supply nozzle unit 121separately and may move or flow in the second direction (e.g., may flowdownward) along the second supply nozzle unit 121. That is, the secondsupply nozzle unit 121 may inject the second source gas toward thesubstrate 210.

The second discharge nozzle unit 122 is formed around an outer portionof the second supply nozzle unit 121. The second discharge nozzle unit122 may surround a portion of the second supply nozzle unit 121. Thesecond discharge nozzle unit 122 may surround the outer portion of thesecond supply nozzle unit 121 and may converge above an upper portion ofthe second supply nozzle unit 121. The second discharge nozzle unit 122forms a channel through which the second source gas is discharged.

The third discharge nozzle unit 123 is formed around an outer portion ofthe second discharge nozzle unit 122. The third discharge nozzle unit123 may be arranged to surround a portion of the second discharge nozzleunit 122. That is, the third discharge nozzle unit 123 may be formedbetween the injection nozzle unit 140 and the second discharge nozzleunit 122. The third discharge nozzle unit 123 forms a channel throughwhich the reactive gas is discharged.

The separation nozzle unit 124 may be formed between the seconddischarge nozzle unit 122 and the third discharge nozzle unit 123. Theseparation nozzle unit 124 may inject a purge gas to prevent thereactive gas and the second source gas from being mixed with each other.The separation nozzle unit 124 may inject the purge gas so that thesecond source gas is discharged through the second discharge nozzle unit122 and the reactive gas is discharged through the third dischargenozzle unit 123.

The purge gas may include an inert gas. For example, the purge gas mayinclude Ar, He, or N₂. The separation nozzle unit 124 may inject theinert gas to prevent or substantially prevent the reactive gas and thesecond source gas from being mixed with each other, as described above.

The second discharge nozzle unit 122 and the third discharge nozzle unit123 are connected to a second discharge pipe 152 that may separatelydischarge the second source gas and the reactive gas to the outside. Aseparation layer 153 may be formed in the second discharge pipe 152 toprevent or substantially prevent the second source gas and the reactivegas from being mixed with each other in the second discharge pipe 152.The supporter 160 is formed outside the second discharge nozzle unit 122to fix the second nozzle unit 120 to the chamber 101.

The injection nozzle unit 140 may be formed between an outer portion ofthe first nozzle unit 110 and an outer portion of the second nozzle unit120. The injection nozzle unit 140 may inject the first gas charged inthe charge space S1 of the chamber 101 toward the lower portion of thecharge space S1 (i.e., in the second direction).

The injection nozzle unit 140 may receive or direct the first gas intoan inflow end 141 between the supporters 160. The inflow end 141 may beformed as a slot or as a plurality of openings or holes. However, forconvenience of explanation, without being limited thereto the followingdescription is made with reference to one or more embodiments whereinthe inflow end 141 is formed as a slot between the first nozzle unit 110and the second nozzle unit 120.

The first gas received into the inflow end 141 may move toward a loweror bottom portion of a side wall of the first nozzle unit 110 or thesecond nozzle unit 120. After the first gas is injected (e.g., injectedtoward the substrate 210) by passing through a discharge end 142, thefirst gas may move to the first discharge nozzle unit 112 of the firstnozzle unit 110 or to the third discharge nozzle unit 123 of the secondnozzle unit 120.

The substrate mounting unit 170 may include a groove in which thesubstrate 210 may be mounted, and may transport the substrate 210 intothe chamber 101. The substrate mounting unit 170 may include a heatingdevice or a refrigerating device for heating or refrigerating thesubstrate 210, respectively, and may include a fixing device to fix thesubstrate 210. The fixing device may be any suitable device, forexample, the fixing device may be a clamp, a pressurizing device, anadhesive material, etc.

During deposition, the substrate mounting unit 170 moves in areciprocating motion a plurality of times along a substantially straightline (e.g., a straight line or a substantially straight line parallel tothe first direction) under the first nozzle unit 110 and the secondnozzle unit 120. The number of reciprocating movements may determine athickness of a thin film deposited on the substrate 210.

Hereinafter, a method of manufacturing a display apparatus by using theapparatus for manufacturing a display apparatus 1 is described.

The substrate 210 having the display unit D formed thereon (e.g., thesubstrate 210 having the display unit D formed on a surface thereof) maybe inserted into the chamber 101 via the loading unit 10. The chamber101 may be filled with a reactive gas.

An encapsulation layer may be formed by the first nozzle unit 110 andthe second nozzle unit 120. The first nozzle unit 110 and the secondnozzle unit 120 may be sequentially arranged in the first direction. Thefirst nozzle unit 110 may deposit an organic layer or an inorganic layeron the display unit D by using a chemical vapor deposition method. Thesecond nozzle unit 120 may deposit an inorganic layer on the displayunit D by using an atomic layer deposition method.

The first nozzle unit 110 may inject a first source gas toward thesubstrate 210 and the injection nozzle unit 140 may inject the reactivegas inside the chamber 101 toward the substrate 210. The reactive gasand the first source gas may be mixed to form the organic layer or theinorganic layer on the substrate 210. After the reaction is completed,the first source gas and the reactive gas may pass through the firstdischarge nozzle unit 112 and move to the first discharge pipe 151 to bedischarged to the outside. That is, the first source gas and thereactive gas may be injected in the second direction (or the downwarddirection), and after the reaction may be discharged in a thirddirection opposite to the second direction (e.g., in an upwarddirection).

The second nozzle unit 120 may inject a second source gas toward thesubstrate 210 and the injection nozzle unit 140 may inject the reactivegas inside the chamber 101 toward the substrate 210. The second sourcegas may be injected in the second direction, and then may flow into thesecond discharge nozzle unit 122 to move to the second discharge pipe152. The reactive gas may be injected in the second direction, and thenmay flow into the third discharge nozzle unit 123 to move to the seconddischarge pipe 152. The separation nozzle unit 124 may be formed betweenthe second discharge nozzle unit 122 and the third discharge nozzle unit123 to prevent the reactive gas and the second source gas from beingmixed with each other.

The substrate 210 may make a reciprocating movement in the firstdirection along which the first nozzle unit 110 and the second nozzleunit 120 are arranged. The organic layer and the inorganic layer may besequentially deposited on the display unit D of the substrate 210,according to the arrangement of the first nozzle unit 110 and the secondnozzle unit 120.

The substrate 210 may move to the unloading unit 30 and may be insertedinto the protection layer forming device 40. The protection layerforming device 40 may form the protection layer P on the encapsulationunit E.

The protection layer P may include a metal-based oxide or a metal-basednitride, such as SiNx, SiOxNy, TIOx, TINx, TiOxNy, ZrOx, TaNx, TaOx,HfOx, and/or AlOx.

The protection layer P may be formed to completely surround a sidesurface of the encapsulation unit E. Thus, the protection layer P mayprotect the encapsulation unit E from moisture or oxygen, therebyincreasing the life span of the thin film encapsulation unit E.

FIG. 5 is a cross-sectional view that illustrates a method of cleaningthe thin film encapsulation manufacturing device 20 of FIG. 1.

Referring to FIG. 5, a method of cleaning the thin film encapsulationmanufacturing device 20 is provided below.

A thin film encapsulation manufacturing device is typically cleanedperiodically after a plurality of deposition processes is completed.According to one or more exemplary embodiments of the present invention,after the deposition processes are completed, a cleaning gas is chargedin the charge space S1 of the chamber 101. The cleaning gas may beinjected into the chamber through the inflow pipe 102.

The cleaning gas may flow into the first nozzle unit 110 and the secondnozzle unit 120 through the injection nozzle unit 140. For example, thecleaning gas may move to the inflow end 141 formed between thesupporters 160 in the charge space S1 and may be discharged through thedischarge end 142 of the injection nozzle unit 140.

Then, the cleaning gas may pass through the first discharge nozzle unit112 to clean the first nozzle unit 110. The cleaning gas may also passthrough the second discharge nozzle unit 122 and the third dischargenozzle unit 123 to clean the second nozzle unit 120.

According to the method and apparatus for manufacturing a displayapparatus 1, durability of the display apparatus may be improved bysequentially stacking the inorganic layer and the organic layer.

According to the method and apparatus for manufacturing a displayapparatus 1, efficiency of deposition may be improved by applying boththe chemical vapor deposition method and the atomic layer depositionmethod in one chamber.

According to the method and apparatus for manufacturing a displayapparatus 1, the same reactive gas may be used in the first nozzle unit110 and the second nozzle unit 120 so that a space utility of theapparatus for manufacturing the display apparatus 1 may be increased.

According to the method and apparatus for manufacturing a displayapparatus 1, the cleaning gas may be injected by the injection nozzleunit 140 so that the cleaning operation may be performed withoutrequiring separation or disassembly of the apparatus for manufacturing adisplay apparatus 1.

FIG. 6 is a cross-sectional view of the substrate 210 that ismanufactured by the apparatus for manufacturing a display apparatus 1 ofFIG. 1.

Referring to FIG. 6, a display apparatus 200 may include the substrate210, the display unit D, the encapsulation unit E, and the protectionlayer P.

The display unit D may be formed on the substrate 210. The display unitD may include a thin film transistor TFT, a passivation layer 270 may beformed to cover the TFT, and an organic light-emitting device (OLED) maybe formed on the passivation layer 270.

The substrate 210 may be formed of a glass material, but the presentinvention is not limited thereto. The substrate 210 may be formed of aplastic material, or a metal material such as SUS and/or Ti. Thesubstrate 210 may be formed of polyimide (PI). Hereinafter, for ease ofdescription, reference is made to one or more embodiments wherein thesubstrate 210 is formed of the glass material.

A buffer layer 220 formed of an organic compound and/or an inorganiccompound may be formed on the substrate 210. The buffer layer 220 may beformed of SiOx (x≧1) and/or SiNx (x≧1).

An active layer 230 (e.g., an active layer 230 that is arranged by apre-determined pattern) is formed on the buffer layer 220, and theactive layer 230 is covered by a gate insulating layer 240. The activelayer 230 includes a source region 231, a drain region 233 and a channelregion 232 between the source region 231 and the drain region 233.

The active layer 230 may include any suitable material or materials. Forexample, the active layer 230 may include an inorganic semiconductormaterial, such as amorphous silicon or crystalline silicon. According toother embodiments, the active layer 230 may include an oxidesemiconductor. For example, the oxide semiconductor may include oxide ofa material selected from groups 12, 13, and 14 metal elements, such asZn, In, Ga, Sn, Cd, Ge, and Hf, and a compound thereof. For example, theactive layer 230 formed of a semiconductor may include G-I—Z—O[(In203)a(Ga203)b(ZnO)c] (where a, b, and c are real numbers thatrespectively satisfy conditions of a≧0, b≧0, and c>0). However, for easeof description, reference is made to one or more embodiments wherein theactive layer 230 is formed of amorphous silicon.

The active layer 230 may be formed by patterning a polycrystallinesilicon layer. For example, an amorphous silicon layer may be formed onthe buffer layer 220 and then crystallized, forming a polycrystallinesilicon layer that may then be patterned. The source region 231 and thedrain region 233 of the active layer 230 may be doped with impurities,according to types of the TFT, such as a driving TFT and a switchingTFT.

A gate electrode 250 corresponding to the active layer 230 and aninterlayer insulating layer 260 covering the gate electrode 250 areformed on the gate insulating layer 240.

Then, after a contact hole H is formed on the interlayer insulatinglayer 260 and the gate insulating layer 240, a source electrode 271 anda drain electrode 272 are formed on the interlayer insulating layer 260,to respectively contact the source region 231 and the drain region 233.

A passivation layer 270 is formed on the TFT, and a pixel electrode 281of the OLED is formed on the passivation layer 270. The pixel electrode281 contacts the drain electrode 272 of the TFT via a via hole H2 formedon the passivation layer 270. The passivation layer 270 may be formed ofan inorganic material and/or an organic material, and may be formed as asingle layer or as two or more layers. The passivation layer 270 may beformed as a planarization layer wherein an upper surface of thepassivation layer 270 is flat regardless of a curve of a lower layer.However, the passivation layer 270 may also be formed to be bentaccording to the curve of the lower layer. Also, the passivation layer270 may be formed as a transparent insulator to have a resonance effect.

After the pixel electrode 281 is formed on the passivation layer 270, apixel-defining layer 290 layer is formed of an organic layer and/or aninorganic layer to cover the pixel electrode 281 and the passivationlayer 270. The pixel-defining layer 290 may have an opening to exposethe pixel electrode 281.

Next, an intermediate layer 282 and an opposite electrode 283 are formedon at least the pixel electrode 281.

The pixel electrode 281 may function as an anode, and the oppositeelectrode 283 may function as a cathode. However, the present inventionis not limited thereto and the pixel electrode 281 and the oppositeelectrode 283 may have opposite polarities.

The pixel electrode 281 and the opposite electrode 283 are insulatedfrom each other by the intermediate layer 282, and light is emitted froman organic emission layer by applying voltages of different polaritiesto the intermediate layer 282.

The intermediate layer 282 may include the organic emission layer.According to one or more embodiments, the intermediate layer 282 mayinclude the organic emission layer, and may further include at least oneselected from a hole injection layer (HIL), a hole transport layer(HTL), an electron transport layer (ETL), and an electron injectionlayer (EIL).

A unit pixel includes a plurality of sub-pixels that may each emit lightof various colors. For example, the plurality of sub-pixels mayrespectively emit lights of red, green, and blue colors or the pluralityof sub-pixels may emit lights of red, green, blue, and white colors,respectively.

The organic emission layer may be formed according to any suitable shapeor color. For example, a blue organic emission layer, a green organicemission layer, and a red organic emission layer may be formed in thesub-pixels, respectively, so as to form a unit pixel. Also, in additionto the blue, green, and red organic emission layers, an organic emissionlayer of another color may be formed in a sub-pixel. In particular, inaddition to the blue, green, and red organic emission layers, a whiteemission layer may be formed in a sub-pixel, by stacking the blue,green, and red organic emission layers to form a unit pixel.

Also, although reference is made to each pixel including an emissionmaterial, the present inventive concept is not limited thereto. Forexample, the organic emission layer may be commonly formed in the entirepixels, regardless of a location of each pixel. For example, the organicemission layer may be formed by vertically stacking or mixing layersthat include emission materials emitting, for example, a red light, agreen light, and a blue light. The organic emission layer may also beformed by other color combinations which may emit a light of a whitecolor. Also, the organic emission layer may further include a colorconverting layer or a color filter that converts the white light that isemitted into a pre-determined color.

The intermediate layer 282 is not limited to the exemplary embodimentsdescribed above. However, for convenience of description, the followingdescription is made with reference to embodiments wherein the blueorganic emission layer, the green organic emission layer, and the redorganic emission layer are formed as sub-pixels so as to form a unitpixel.

When the substrate 210 including the display unit D is inserted into thechamber 101 via the loading unit 10, the encapsulation unit E may beformed on the display unit D. The encapsulation unit E may include aplurality of inorganic layers or may include an inorganic layer and anorganic layer.

The organic layer of the encapsulation unit E is formed of a polymer,and may be a single layer or stacked layers formed of at least one ofpolyethylene ether phthalate, polyimide (PI), polycarbonate (PC), epoxy,polyethylene, and/or polyacrylate (PAR). The organic layer may be formedof polyacrylate (PAR), and more particularly may include a polymerizedmonomer composition including a diacrylate monomer and/or a triacrylatemonomer. The monomer composition may further include a monoacrylatemonomer. The monomer composition may further include a photoinitiatorthat is well known to those of ordinary skill in the art, such asthermoplastic polyolefin (TPO), but the present invention is not limitedthereto. The monomer composition may include epoxy, PI, polyethyleneether phthalate, PC, polyethylene, and/or PAR.

The inorganic layer of the encapsulation unit E may be a single layer ormay be stacked layers including metal oxide or metal nitride. Inparticular, the inorganic layer may include any one of SiO₂, SiNx,Al₂O₃, TiO₂, ZrOx, and/or ZnO.

An uppermost layer of the encapsulation unit E, which is exposed to theoutside, may be formed as the inorganic layer to waterproof the OLED.

The encapsulation unit E may include at least one sandwich structure inwhich at least one organic layer is inserted between at least twoinorganic layers. As another example, the encapsulation unit E mayinclude at least one sandwich structure in which at least one inorganiclayer is inserted between at least two organic layers. As yet anotherexample, the encapsulation unit E may include the sandwich structure inwhich at least one organic layer is inserted between at least twoinorganic layers and the sandwich structure in which at least oneinorganic layer is inserted between at least two organic layers.

The encapsulation unit E may include a first inorganic layer, a firstorganic layer, and a second inorganic layer sequentially stacked fromthe top of the OLED.

According to another embodiment, the encapsulation unit E may include afirst inorganic layer, a first organic layer, a second inorganic layer,a second organic layer, and a third inorganic layer sequentially stackedfrom the top of the OLED.

According to another embodiment, the encapsulation unit E may include afirst inorganic layer, a first organic layer, a second inorganic layer,a second organic layer, a third inorganic layer, a third organic layer,and a fourth inorganic layer sequentially stacked from the top of theOLED.

According to another embodiment, the encapsulation unit E may include afirst inorganic layer, a first organic layer, a second inorganic layer,and a second organic layer.

According to another embodiment, the encapsulation unit E may include afirst organic layer, a first inorganic layer, a second organic layer, asecond inorganic layer, and a third organic layer.

According to another embodiment, the encapsulation unit E may include afirst organic layer, a second organic layer, a first inorganic layer, athird organic layer, a fourth organic layer, a second inorganic layer, afifth organic layer, and a sixth organic layer.

According to another embodiment, the encapsulation unit E may include afirst inorganic layer U1, a first organic layer O1, a second inorganiclayer U2, a second organic layer O2, a third inorganic layer U3, and athird organic layer O3 sequentially stacked from the bottom of the OLED.

A halogenated metal layer, including LiF, may further be includedbetween the OLED and the first inorganic layer. The halogenated metallayer may prevent the OLED from being damaged when forming the firstinorganic layer by sputtering.

The first organic layer may have a smaller area than the secondinorganic layer, and the second organic layer may have a smaller areathan the third inorganic layer.

The encapsulation unit E is not limited to the description above, andmay include all structures in which the inorganic layer and the organiclayer are stacked in various shapes and arrangements.

As described above, according to one or more exemplary embodiments, adisplay apparatus 200 manufactured according to the method and apparatusfor manufacturing a display apparatus 1 may have an increased life span.Also, the apparatus for manufacturing a display apparatus 1 may becleaned without the need for disassembly or separation of the apparatusfor manufacturing a display apparatus 1.

It should be understood that the exemplary embodiments described hereinare provided to enhance understanding and not for purposes oflimitation. Descriptions of features or aspects within each exemplaryembodiment should be considered as available for other similar featuresor aspects in other exemplary embodiments.

While one or more exemplary embodiments have been described withreference to the figures, it will be understood by those of ordinaryskill in the art that various changes in form and details may be madetherein without departing from the spirit and scope as defined by thefollowing claims, and their equivalents.

What is claimed is:
 1. An apparatus for manufacturing a displayapparatus, the apparatus comprising: a chamber; a first nozzle unit atthe chamber, the first nozzle unit configured to deposit an organiclayer or an inorganic layer on a substrate; a second nozzle unit at thechamber, the second nozzle unit configured to deposit the organic layeror the inorganic layer on a substrate and the second nozzle unit beinglinearly aligned with the first nozzle unit in a first direction; and aninjection nozzle unit between the first nozzle unit and the secondnozzle unit, the injection nozzle unit configured to inject a first gasin the chamber toward the substrate.
 2. The apparatus of claim 1,wherein the first gas is injected by the injection nozzle unit and isdischarged by the first nozzle unit or the second nozzle unit.
 3. Theapparatus of claim 1, wherein the first nozzle unit comprises: a firstsupply nozzle unit that injects a first source gas; and a firstdischarge nozzle unit between the injection nozzle unit and the firstsupply nozzle unit, the first discharge nozzle unit discharging at leastone selected from the first gas and the first source gas.
 4. Theapparatus of claim 3, wherein the first discharge nozzle unit dischargesa mixture of the first gas and the first source gas.
 5. The apparatus ofclaim 3, wherein the first source gas and the first gas are injected ina second direction toward the substrate and are discharged in a thirddirection opposite to second direction.
 6. The apparatus of claim 1,wherein the second nozzle unit comprises: a second supply nozzle unitthat injects a second source gas; a second discharge nozzle unit outsidethe second supply nozzle unit, the second discharge nozzle unitdischarging the second source gas; and a third discharge nozzle unitbetween the injection nozzle unit and the second discharge nozzle unit,the third discharge nozzle unit discharging the first gas.
 7. Theapparatus of claim 6, wherein the second nozzle unit further comprises aseparation nozzle unit between the second discharge nozzle unit and thethird discharge nozzle unit, the separation nozzle unit injecting apurge gas.
 8. The apparatus of claim 6, wherein the second nozzle unitdischarges the first gas and the second source gas separately.
 9. Theapparatus of claim 6, wherein the second source gas and the first gasare injected in a second direction toward the substrate and aredischarged in a third direction opposite to the second direction. 10.The apparatus of claim 1, wherein the injection nozzle unit injects thefirst gas stored in the chamber in a second direction toward thesubstrate to concurrently clean the first nozzle unit and the secondnozzle unit.
 11. The apparatus of claim 1, wherein the first nozzle unitand the second nozzle unit have the same size.
 12. The apparatus ofclaim 1, further comprising a substrate mounting unit under the firstnozzle unit and the second nozzle unit, the substrate mounting unitmoving in a linear reciprocating motion in the first direction andholding the substrate, the substrate having a display unit thereon. 13.The apparatus of claim 1, further comprising: a loading unit connectedto an end of the chamber and that inserts the substrate into thechamber, the substrate having a display unit thereon; and an unloadingunit connected to an opposite end of the chamber after at least oneselected from of the organic layer and the inorganic layer is formed onthe substrate.
 14. The apparatus of claim 13, further comprising aprotection layer-forming device connected to the unloading unit.
 15. Anapparatus for manufacturing a display apparatus, the apparatuscomprising: a chamber configured to be filled with a first gas; anencapsulation layer-forming nozzle unit at the chamber and including afirst nozzle unit that deposits an organic layer or an inorganic layerand a second nozzle unit that deposits the organic layer or theinorganic layer, the second nozzle unit being spaced apart from thefirst nozzle unit; and a substrate mounting unit under the encapsulationlayer-forming nozzle unit, that moves in a linear reciprocating motionin a first direction and is holds a substrate having a display unitformed thereon
 16. The apparatus of claim 15, wherein the first gaspasses through a gap between the first nozzle unit and the second nozzleunit to flow into the first nozzle unit and the second nozzle unit. 17.The apparatus of claim 15, wherein the first nozzle unit injects a firstsource gas toward the substrate and discharges a mixture of the firstsource gas and the first gas, and the second nozzle unit injects asecond source gas toward the substrate and discharges the second sourcegas and the first gas separately.
 18. A method of manufacturing adisplay apparatus, the method comprising: inserting a substrate into achamber filled with a reactive gas, the substrate having a display unitformed on a surface thereof; forming an encapsulation layer bydepositing an organic layer or an inorganic layer on the display unitvia a first nozzle unit inside the chamber and depositing the organiclayer or the inorganic layer on the display unit via a second nozzleunit linearly aligned with the first nozzle unit; and forming aprotection layer on the encapsulation layer via a protectionlayer-forming device connected to the chamber.
 19. The method of claim18, wherein the forming of the encapsulation layer comprises forming theorganic layer by mixing a first source gas and the reactive gas in thefirst nozzle unit and forming the inorganic layer by separating a secondsource gas and the reactive gas in the second nozzle unit.
 20. Themethod of claim 18, further comprising cleaning the first nozzle unitand the second nozzle unit by injecting a cleaning gas into the chamber.